1. Tiwari, B., Blot, M., Laurent, G. J., Agnus, J., Sandoz, P., Lutz, P., & Clevy, C. T. (2021). A High Range-to-Resolution Multi-axis Force and Torque Sensing Platform. IEEE/ASME Transactions on Mechatronics.
  2. Awde, A., Boudaoud, M., Régnier, S., & Clévy, C. (2020). Observer-Based Disturbance Control for Small-Scale Collaborative Robotics. In 2020 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS) (pp. 2872-2878).
  3. Sakr, S., Cagneau, B., Daunizeau, T., Régnier, S., & Haliyo, S. (2020, July). Haptic Remote Control Interface for Robotic Micro-Assembly at Low Frequency. In International Conference on Manipulation, Automation and Robotics at Small Scales (pp. 1-7).
  4. Placet, V., Blot, M., Weemaes, T., Bernollin, H., Laurent, G., Amiot, F., ... & Beaugrand, J. (2020). Transverse compressive properties of natural fibers determined using micro mechatronic systems and 2D full-field measurements. Materials Today: Proceedings, 31, S303-S308.
  5. Tiwari, B., Clévy, C., & Lutz, P. (2019). High-Precision Gluing Tasks Based on Thick Films of Glue and a Microrobotics Approach. IEEE Robotics and Automation Letters, 4(4), 4370-4377.
  6. Cailliez, J., Boudaoud, M., Mohand-Ousaid, A., Weill–Duflos, A., Haliyo, S., & Regnier, S. (2019). Modeling and experimental characterization of an active mems based force sensor. Journal of Micro-Bio Robotics, 15(1), 53-64.
  7. Tiwari, B., Clévy, C., & Lutz, P. (2019, May). Analysis of Forces during UV Glue Curing for Micro-Assembly Applications. In  IEEE Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) (pp. 1-6).
  8. Sakr, S., Daunizeau, T., Reversat, D., Régnier, S., & Haliyo, S. (2018, October). An ungrounded master device for tele-microassembly. In IEEE/RSJ International Conference on Intelligent Robots and Systems.
  9. B. Komati, C. Clévy and P. Lutz, Sliding Mode Impedance Controlled Smart Fingered Microgripper for Automated Grasp and Release Tasks at the Microscale, International Precision and Assembly Seminar, IPAS 2018, Chamonix, France.
  10. S. Sakr, T. Daunizeau, D. Reversat, S. Régnier and S. Haliyo A Handheld Master Device for 3D Remote Micro-manipulation MARSS’2018, Nagoya, Japan.
  11. J. Cailliez, M. Boudaoud, A. Mohand-Ousaid, A. Weill–Duflos, S. Haliyo and S. Régnier Modeling and Experimental Characterization of an Active MEMS Based Force Sensor, MARSS’18, Nagoya, Japan.
  12. Bettahar, C. Clévy, F. Behague, N. Courjal and P. Lutz, Novel Strategy for High Precision Automated Robotic Positioning based on Fabry-Perot Interferometry Principle, IEEE CASE Conference on Automation Science and Engineering, Munich, Germany, August 2018.
  13. J. Cailliez, M. Boudaoud, S. Liang, and S. Régnier A multi-model design for robust hybrid control of non-linear piezoelectric actuators at the micro/nano scales. American Control Conference ACC’18, Miwaukee, USA.
  14. A. Benouhiba, D. Belharet, A. Bienaimé, V. Chalvet, M. Rakotondrabe & C. Clévy, Development and characterization of thinned PZT bulk technology based actuators devoted to a 6-DOF micropositioning platform, Microelectronic Engineering, May 2018.
  15. Guelpa, J. S. Prax, Y. Vitry, O. Lehmann, S. Dehaeck, P. Sandoz, C. Clévy, N. Le Fort-Piat, P. Lambert and G.J. Laurent, 3D-printed vision-based micro-force sensor dedicated to in situ SEM measurements. IEEE/ASME - AIM International Conference on Intelligent Mechatronics, Munich, Germany, July 2017.

Contribution to the organization of: