The MOEMS group will participate to 2015 SPIE Photonics West from 7th to 12th of February in San Francisco. The communications are “Multi-wafer bonding technology for the integration of a micromachined Mirau interferometer”, by W-S. Wang, J. Lullin, M. Wiemer, J. Frömel, S. Bargiel, N. Passilly, C. Gorecki and T. Gessner and “Technological platform for vertical 3D multi-wafer integration of miniature imaging instruments”, by S. Bargiel, M. Baranski, N. Passilly, C. Gorecki, M. Wiemer, J. Froemel, D. Wuensch, Wei-Shan Wang.